Asetek has won two data centre orders from one of its existing OEM partners for its RackCDU D2C (Direct-to-Chip) liquid cooling solution. The orders have a combined value of approximately $1 million and are for two separate undisclosed HPC (High Performance Computing) installations. One of the installations has purchased Asetek’s liquid cooling technology previously and is moving into phase two deployment. The second is deploying Asetek’s liquid cooling technology for the first time.
“The strategic value of repeat orders is significant for our emerging data centre business. The awards are in line with our goal of increasing end-user adoption with existing OEMs and confirms our ability to leverage our leading position in the HPC segment to reach new end-users,” said André Sloth Eriksen, CEO and founder of Asetek.
RackCDU D2C is a hot water liquid cooling solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data centre server density. D2C removes heat from CPUs, GPUs, memory modules and other high heat components within servers using water as hot as 40°C (105°F), eliminating the need for expensive and inefficient chilled air to cool these components. As air chilling is the largest portion of data center cooling OpEx and CapEx costs, D2C can free up money from constrained data centre budgets for investment in more computing rather than disappearing in support costs.