Regional Summit to offer insight into Open Compute Project principles


The Open Compute Project (OCP) will be hosting its second annual Regional Summit on the 26 & 27 September 2019, at the RAI Amsterdam, which will feature more than 80 presentations on topics, ranging from the challenges and opportunities around artificial intelligence, building a data centre around OCP principles, tackling the environmental impact of the data centre sector, to driving transformation in Telcos through OCP adoption.

At the Global summit in March, the Foundation announced two new sub-projects:  Open Domain Specific Architecture (ODSA) & the Open Accelerator Module(OAM). A dedicated track on ODSA and Accelerator Infrastructure will highlight the significant progress both projects are making to deliver accelerator chips and the infrastructure to deploy the silicon. ODSA is not only developing specs and tools to integrate multi-party chipsets onto SOC’s, they will deliver the first prototype as early as this year.

Since the Global summit, the OAM project has expanded in scope to now address power/cooling, robustness, serviceability, configuration, programming, management and debug, as well as inter-module communication to scale up and input/output bandwidth to scale out. Open infrastructure is needed to intercept rapid innovation in artificial intelligence. This track is where open accelerator infrastructure meets open artificial intelligence.

OpenEDGE is a new project and a new track for Amsterdam. An open hardware platform is already available and we will hear from a variety of suppliers that plan to support this platform, including a discussion on how the ARM architecture is being enabled for OCP OpenEdge.

The Data Centre Facilities track is loaded with new ideas and case studies on how OCP principles are reshaping the facility with modularity and energy conservation. Colo facilities in Europe are receiving the OCP Ready recognition.

In Amsterdam last year the Foundation launched the Advanced Cooling Solutions project, which covers immersion, cold plate and door heat exchangers (HEx). All three options will be discussed along with the harmonization efforts necessary to make these solutions easier to adopt and deploy. Updates to the OpenRack standard and compatible power systems, including a power module interoperability proposal, are also being discussed in this track.

The full agenda is now available here.

Learn more about the event, register and explore sponsorship and exhibit opportunities here:


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